equipment
What is it?
Debonder
Manufacturer: TEL
Model Name: SYNAPSE Z-PLUS
Applications: Fully automated wafer debonding system for 300mm bonded wafers on dicing frame
Instrument Overview: Fully automated wafer debonding system for 300mm bonded wafers on dicing frame
Technical features and specifications:
Room temperature processing with in-situ cleaning function
Debonding capabilities
40um for device wafers with fabrication
20um for blanket wafers without edge trimmed
Charges:
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Instrument Manufacturer URL: NA
Detailed Specifications:
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