equipment
What is it?
Cluster Bond
Manufacturer: EVG
Model Name: Gemini
Applications: Multiple bonding chambers (Temporary, Fusion & Euthetic / Anodic Bonding)
Instrument Overview: Manual or Fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding
Technical features and specifications:
Bridge Tool which can handle both 200mm & 300mm wafers
In-situ Plasma Chamber clean & Wet clean for Fusion Bonding
High Temp processes of up to 500 deg C
Up to 50kN Bonding Pressure Capability
Wafer handling system is separated from bond chuck handling system
Charges:
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Instrument Manufacturer URL: NA
Detailed Specifications:
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