Electroplating: BR-ECP-TSV-NOK

What is it?
Electroplating

Manufacturer: AMAT

Model Name: Nokota ECP

Applications: TSV Cu Electroplating
Cu damascene BEOL process
Pressure sensors
Cu Nano Vias/Trenches
Instrument Overview: Cu Electroplating for Void-free TSV filling
• Cu damascene plating
200mm & 300mm application
Low overburden control
Technical features and specifications: Type:Si,Si-on-insulator,Bonded Wafers
200mm or 200mm wafer process
Warpage: up to 2mm
Thickness: 0.6-1.4 mm

Charges:
Contact Admin

Instrument Manufacturer URL: NA

Detailed Specifications: