A*STAR Scientific Equipment Finder

Mechanical processing: Dicing Cleaning and Drying System (Disco)

equipment

2 Fusionopolis Way, Innovis, #08-03 Singapore 138634

What is it?
This is a dicing system for cutting electronic component materials such as Silicon and glass.br>
Manufacturer: DISCO Corporation

Model Name: DAD321 AUTOMATIC DICING SAW

Applications: cutting, grooving

Instrument Overview: DAD3231 was designed to handle round sample of size from 1 inch to 6 inch, or square sample from 1 inch to 4 inch. <

Technical features and specifications:
X-Axis Cutting Range: 150mm
X-Axis Cutting Speed: 0.1 – 50 mm/s
Y-Axis Cutting Range: 150mm
Index step: 0.001 mm
θ-axis Max Rotation Angle: 320 Degrees

Charges:


Instrument Manufacturer URL: NA

Detailed Specifications:

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