Mechanical processing: Mechanical (wedge) wafer debonder (DB12T)

What is it?
 Mechanical (wedge) wafer debonder

Manufacturer:  SUSS MicroTec

Model Name:  DB12T

Applications: Debonding of temporarily bonded wafer pairs Wafer-scale 2D film peel-off from growth substrates

Instrument Overview:  Mechanically debonds temporarily bonded wafer pairs / wafer-tape structures.

Technical features and specifications:
Compatible with 4 inch, 6 inch, 8 inch wafer pairs. A number of debond parameters adjustable.

Charges:
N.A.

Instrument Manufacturer URL: https://www.suss.com/en (OEM) https://www.zmc.net/zmc-technologies/ (SG vendor)

Detailed Specifications:
https://www.suss.com/en/products-solutions/wafer-bonder/db12t