Mechanical processing: Wafer Bonder System (EVG 510/200)

 What is it? 
   A wafer bonding tool that supports all common wafer bonding processes such as anodic, glass frit, solder, eutectic, transient liquid phase, and direct.
 
  Manufacturer: EVG
 
  Model Name:  EVG510-200
 
  Applications: Wafer bonding
  
  Instrument Overview: Bonds up to 60 kN force at temperatures up to 550°C
  
  Technical features and specifications: 
   Can handle substrate sizes from pieces to 200 mm.
  Charges:
   User operated: NA/hour, Staff operated: NA/hour
 
  Instrument Manufacturer URL: https://www.evgroup.com/
 
  Detailed Specifications: 
   https://www.evgroup.com/products/bonding/permanent-bonding-systems/evg510/