equipment
What is it?
BR-PAT-IR-TSV
Manufacturer: Sentronics
Model Name: SEMDEX A
Applications: Backgrind thickness accuracy
Instrument Overview: Fully Automated handling system for 12" and 8" Wafers and in 12" Film Frame
Remaining silicon thickness measurements
Wafer Bow and FOWLP high warp measurement
Technical features and specifications:
3um minimum resolution for Si thickness measurement, Accuracy < 0.3 μm
10nm to 10um thin films thickness measurement
+/- 5 mm warpage capability
Surface Roughness measurement down to 0.5nm Ra
TSV Top CD, 3um to Bottom CD, 2.5um
Fine pitch metal traces of 0.8um line/space
Charges:
Contact Admin
Instrument Manufacturer URL: NA
Detailed Specifications:
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