Packaging: PAT-Plasma-Tepla

What is it?
For Pick and Place.

Manufacturer: Tresky

Model Name: T8000

Applications: For Pick and Place.

Instrument Overview: A bonding platform, build on a bigger granite gantry to combine space with the highest level of bonding accuracy, for prototyping and volume production.

Technical features and specifications:
Pick & place process; reconfiguration; die attach process and flip chip process. Accuracy of ±5um under controlled environment. Chip size: 1 mm x 1 mm to 20 mm x 20 mm Substrate size: 10 mm to 300 mm

Charges:
NA

Instrument Manufacturer URL: NA

Detailed Specifications:
NA