Packaging: PAT-WB-ASM2

What is it?
Leadframe or substrate level bonding

Manufacturer: ASM

Model Name: Eagle Extreme

Applications: Leadframe or substrate level bonding

Instrument Overview: Advanced Fine Pitch Solution of 30um bond pad pitch bonding capability.

Technical features and specifications:
Can bond with gold wireTool Accuracy : +/-2.0um. Capable of handling leadframe widths up to 80mm.

Charges:
NA

Instrument Manufacturer URL: NA

Detailed Specifications:
NA