What is it?
08-PVD-CoSputter
Manufacturer: Evatec
Model Name: EVATEC CLUSTERLINE 200E
Applications: PVD with co-sputter, reactive sputter, Soft Etch process technologies on 200mm substrates, Other potential electrode materials study for MEMS and RF devices application
Instrument Overview: From the modular chuck design for rapid exchange between 100,150 or 200mm format, current setup mainly 200mm. Multisource Quattro (MSQ) with 4 different targets can perform co-sputtering or single target sputter based on the process setup
Technical features and specifications:
Direct thin wafer handling and processing capability for thicknesses down to 70μm and wafer bow up to 4mm.
Chuck temperatures controlled from room temperature up to 500°C, halogen lamp heater solutions with back-gas capability and chuck rotating function are applied to ensure good thickness and uniformity deposition .
Sputter power is provided by DC Pulse generator and RF power supply for reactive sputtering process
Charges:
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Instrument Manufacturer URL: NA
Detailed Specifications:
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